Packaging Technology Service

DXWE provides various packaging services to meet customers' chip packaging needs, including e-SIM card module packaging, DFN, QFN, PDFN, MEMS QFN, RFID DFN/QFN, LGA, SIP and other integrated circuit chip packaging forms. With "diverse packaging forms, complete packaging sizes, leading technology, high yield, stable quality, and fast service" to serve customers and the market, serving the development of China's electronics industry. We cooperate with customers in multiple modes from chip design and packaging design aspects to meet customers' requirements for product performance, quality, cycle and cost.