Technical Services

DXWE Microelectronics provides comprehensive integrated circuit packaging and testing services

We are committed to providing customers with one-stop solutions from chip design verification to packaging, testing and reliability analysis.

One-stop Service

Providing comprehensive one-stop services from chip design verification, packaging, testing to module product manufacturing, covering 5G IoT, medical, communications and other fields.

Packaging Technology Service

Focusing on advanced packaging technologies such as QFN/DFN, BGA/LGA, MEMS, SiP, FC, WLCSP, providing diversified packaging options and customization services.

Testing Technology Service

With comprehensive testing capabilities including CP testing, FT testing, SLT testing, covering analog, digital, mixed-signal, RF and other chip types.

Reliability Testing & Failure Analysis

Providing reliability testing services compliant with JEDEC, AEC-Q and other standards, as well as professional failure analysis (FA) services to ensure product quality.