Smart Card Module Package
High-quality smart card chip packaging solutions, widely used in communications, finance and identity recognition
What is Smart Card
Smart cards are also called IC cards, smart cards, microcircuit cards or microchip cards. It embeds a microelectronic chip into a card base that complies with ISO 7816 standards and makes it into a card form.
Due to their inherent advantages of information security, portability, and comprehensive standardization, smart cards are increasingly used in identity authentication, banking, telecommunications, public transportation, parking management and other fields. Examples include second-generation ID cards, bank electronic wallets, telecom mobile SIM cards, public transportation cards, subway cards, parking cards for collecting parking fees, etc., all play important roles in people's daily lives.
Card Module Technology Features
Smart module packaging generally uses substrate layers of carrier tapes, sets single-sided or double-sided gold/copper/alloy circuits, then mounts smart card chips, wire bonding, and after completion, directly molding or UV packaging to achieve high reliability of smart card modules.
High Reliability Packaging
Uses molding or UV packaging processes to ensure high reliability and service life of smart card chips.
Information Security Assurance
Provides data encryption and secure storage functions to ensure the security of personal information and transaction data.
Standardized Design
Complies with international standards such as ISO 7816, ensuring compatibility and interoperability with various card readers.
Process Capability
DXWE Microelectronics has advanced card module packaging processes that can meet the needs of various smart card applications.
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Advanced Bonding Technology
Wire Bond uses Ag Coat Prime, which has bonding properties and reliability comparable to gold wire, effectively reducing product costs.
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Ultra-thin Packaging Technology
UV packaging 6 Pin 4FF (Fill) module, thickness 400~500μm, products are thinner and smaller.
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Diversified Material Selection
Wire materials: gold wire, copper wire, alloy
Mold types: circular, pentagonal, oval, square
Specifications
DXWE Microelectronics has currently achieved: 2FF/3FF series, CPU molding modules, financial banking card dual-interface modules, M2-M3 series, telecom modules, high-end integrated circuit module chip packaging and other packaging forms, meeting different customers' different packaging requirements, and providing high quality and excellent service to customers.
Application Range
Communication Field
Mobile communication SIM cards, eSIM, etc.
Identity Recognition Field
Second-generation ID cards, residence permits, etc.
Financial Field
Bank IC cards, electronic wallets, etc.
Social Security Field
Social security cards, medical insurance cards, etc.
One-Card System Field
City one-card, bus cards, subway cards, etc.
Parking Management
Parking cards, fuel cards, etc.