LGA Package Technology
Land Grid Array packaging, high-density high-performance solution

LGA Package Introduction
LGA stands for Land Grid Array, which is literally translated as grid array packaging. Its main feature is that it uses metal contact packaging to replace the previous pin plugs, and is a packaging technology that can be removed and replaced at any time.
Product Features
Our LGA products can achieve floating chip mounting, double-layer wire arc bonding, cross-wire bonding, and can realize SIP packaging composed of multiple IC chips and different types of components.

High Density
LGA packaging has high packaging density, suitable for compact packaging applications.
Excellent Electrical Performance
The core board of LGA packaging is soldered close to the bottom board surface, which can significantly shorten the distance between the chip and PCB, improving electrical performance.
Process Capability
Parameter | Specification |
---|---|
Package Size | 2*2~12*12mm |
Package Form | Customizable according to customer requirements |
Process Features | High package density, excellent electrical performance, high reliability, good thermal performance, easy installation |
Specifications
Package size: 2*2~12*12mm
Serial No. | Package Type | Pin Count | Package Width/mm | Package Length/mm | Package Thickness/mm | Total Height |
---|---|---|---|---|---|---|
1 | LGA | 6L | 2 | 4 | 0.4 | 0.6 |
2 | LGA | 8L | 1.5 | 4 | 0.4 | 0.6 |
3 | LGA | 16L | 5 | 5 | 1.05 | 1.31 |
4 | LGA | 24L | 3.5 | 6 | 1.05 | 1.31 |
5 | LGA | 56L | 6 | 9 | 1.05 | 1.31 |
Application Range
Applied in information communication, smart home appliances, medical device electronics, wearable products, industrial control, Internet of Things and other fields.
Processors, logic, memory, applied in wearable, 3C digital, medical device electronics, security chips and other fields.
Information Communication
Network equipment, communication modules, wireless transmission equipment, etc.
Smart Home Appliances
Smart home controllers, smart TVs, smart speakers, etc.
Medical Equipment
Electronic components in medical monitoring and diagnostic equipment
Wearable Products
Smart watches, health monitoring devices, activity trackers
Industrial Control
Industrial automation equipment, process control systems, robot control
Internet of Things
Sensor nodes, smart gateways, edge computing devices